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Multilayer varistors (MLVs)
Standard series
A further advantage of adhesion is that the components are subjected to virtually no temperature
shock at all. The curing temperatures of the adhesives are between 120 ° C and 180 ° C, typical
curing times are between 30 minutes and one hour.
The bending strength of glued chips is, in comparison with that of soldered chips, higher by a fac-
tor of at least 2, as is to be expected due to the elasticity of the glued joints.
The lower conductivity of conductive adhesive may lead to higher contact resistance and thus re-
sult in electrical data different to those of soldered components. Users must pay special attention
to this in RF applications.
6
Solderability tests
Test
Standard
Test conditions
Sn-Pb soldering
Test conditions
Pb-free soldering
Criteria/ test results
Wettability
Leaching
resistance
Thermal shock
(solder shock)
IEC Immersion in
60068-2-58 60/40 SnPb solder
using non-activated
flux at 215 ± 3 ° C
for 3 ± 0.3 s
IEC Immersion in
60068-2-58 60/40 SnPb
solder using
mildly activated flux
without preheating
at 260 ± 5 ° C
for 10 ± 1 s
Dip soldering at
300 ° C/5 s
Immersion in
Sn96.5Ag3.0Cu0.5
solder using non- or
low activated flux
at 245 ± 5 ° C
for 3 ± 0.3 s
Immersion in
Sn96.5Ag3.0Cu0.5
solder using non- or
low activated flux
without preheating
at 255 ± 5 ° C
for 10 ± 1 s
Dip soldering at
300 ° C/5 s
Covering of 95% of
end termination,
checked by visual
inspection
No leaching of
contacts
No deterioration of
electrical parameters.
Capacitance change:
≤ ± 15%
Tests of resistance IEC Immersion in Immersion in
to soldering heat 60068-2-58 60/40 SnPb for 10 s Sn96.5Ag3.0Cu0.5
for SMDs at 260 ° C for 10 s at 260 ° C
Change of varistor
voltage:
≤ ± 5%
Tests of resistance IEC
to soldering heat 60068-2-20
for radial leaded
components
(SHCV)
Immersion
of leads in
60/40 SnPb
for 10 s at 260 ° C
Immersion
of leads in
Sn96.5Ag3.0Cu0.5
for 10 s at 260 ° C
Change of varistor
voltage: ≤ ± 5%
Change of
capacitance X7R:
≤ 5/+10%
Please read Cautions and warnings and
Important notes at the end of this document.
Page 72 of 81
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